General Information

Req #
WD00030436
Career area:
Hardware Engineering
Country/Region:
China
State:
Anhui
City:
合肥(Hefei)
Date:
Wednesday, May 11, 2022
Working time:
Full-time
Additional Locations

Why Work at Lenovo

We are Lenovo. We do what we say. We own what we do. We WOW our customers.

Lenovo is a US$62 billion revenue global technology powerhouse, ranked #217 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver smarter technology for all, Lenovo has built on its success as the world’s largest PC company by further expanding into growth areas that fuel the advancement of ‘New IT’ technologies (client, edge, cloud, network, and intelligence) including server, storage, mobile, software, solutions, and services.

This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our StoryHub.

Description and Requirements

Description:

  1. Optimize system design for power and performance, lead and drive the adaptive performance design for overall products.
  2. Participate in in-house design and development of next generation products from concept to mass production.   
  3. Be the technical contact at OEM site to support various engineering builds. Represent the EE team in a cross-functional team environment. 
  4. Identifying EE related issues. Drive resolution of cross-functional issues including those related to HW architecture including but not limited to performance, power consumption, thermal behavior, and production related such as quality, failure analysis, manufacturing, and development related such as schematic design, PCB layout, and overall system integration. 


Requirements:

  1. BSEE required. MSEE preferred. 
  2. Minimum of 4 years of work experience in the design and development of computer electronic design and production.  
  3. Direct experience in high volume computers /communication devices /consumer electronics preferred.
  4. Must have a solid understanding of the system development process including concept creation, schematics and board development, as well as board and system bring up and debugging.   
  5. Must have direct experience with one or more of the following technologies: low power design, high density power design, x86 power delivery design, ARM power delivery design, and their design issues.   
  6. Software and scripting experience a plus.
  7. Prefer to have X86 or ARM platform product power management experience. 
  8. Must have excellent communication skills in both English and Chinese.  

Additional Locations