Why Work at Lenovo
Description and Requirements
About Lenovo
Focused on a bold vision to deliver smarter technology for all, we are developing world-changing technologies that create a more inclusive, trustworthy and sustainable digital society. By designing, engineering and building the world’s most complete portfolio of smart devices and infrastructure, we are also leading an Intelligent Transformation – to create better experiences and opportunities for millions of customers around the world. Join us in defining our world of tomorrow and creating smarter technology for all!
Who You'll Work With
Lenovo Workstations provide powerful solutions to drive productivity, innovation, and design excellence in key vertical segments such as Manufacturing Design, Engineering & CAD, Animation/Media/Web Creation, Science/Medical, Oil & Gas, and Finance.
To maintain our leadership and compete in this aggressive marketplace, we are seeking to enhance our team with a Thermal Engineer. Responsibilities include innovative design, development, and validation of workstation thermal solutions. Solutions range from dedicated active CPU coolers on high-end desktop workstations to passive heatsinks found on add-in cards. The solution extends holistically to cooling the system efficiently and effectively for highest performance.
What You'll Do
For this role you will be working with a combination of HW/SW architects and engineers. Teamwork is critical in this role as there are always trade-offs that need to be managed with physical, cost, and time constraints.
Basic Requirements:
- Bachelor's Degree or higher in Mechanical Engineering, or equivalent
- Results oriented in a fast-paced environment
- Ability to multi-task
- Excellent interpersonal and communication skills
- Positive professional attitude with flexibility
Preferred Requirements or courses in the following areas:
- Previous internship experience
- Heat transfer, both passive and active forced air
- FEA thermal analysis
- CFD modeling and analysis
- Familiarity with thermal interface materials, heatsinks, and heat spreaders