Lenovo

Hardware/Software Engineering Intern - Lenovo Workstation (HBCU Program)

Ingénierie matérielle

États-Unis d’Amérique, North Carolina, Morrisville
N° de demande: WD00015393
Posted 17-Nov-2021

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Head - Customer Excellence

Services

Inde, Karnataka, BANGALORE
N° de demande: WD00044194
Posted 09-Nov-2022

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Head of EMEA Chief team

Comptabilité/Finances

Slovaquie, Bratislavský kraj, Bratislava
N° de demande: WD00047659
Posted 16-Dec-2022

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HK Intern

Juridique

Hong Kong, Hong Kong
N° de demande: 100014521
Posted 22-Dec-2022

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HPC & AI Product Manager

Gestion de produits

Mexique, Nuevo León, Monterrey
N° de demande: WD00037980
Posted 01-Sep-2022

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HPC Technical Consultant

Ingénierie

Inde, West Bengal, Kolkotta
N° de demande: WD00039429
Posted 26-Aug-2022

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HPC Technical Sales / Architect

Ventes

Royaume-Uni, Hampshire, BASINGSTOKE
N° de demande: WD00042540
Posted 17-Oct-2022

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HPC/AI Performance Benchmarking Engineer

Service après-vente

Royaume-Uni, Hampshire, BASINGSTOKE
N° de demande: WD00041389
Posted 05-Oct-2022

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HR Admin Trainee (paid internship)

Ressources humaines

Roumanie, Bucharest
N° de demande: 100014381
Posted 10-Nov-2022

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HR Intern

Ressources humaines

Mexique, Distrito Federal, Mexico D.F.
N° de demande: 100014361
Posted 21-Oct-2022

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