Lenovo

Global Finance Talent Program: Finance Analyst (Treasury)

Buchhaltung/Finanzwesen

Hongkong, Hong Kong
Anf. Nr.: WD00041534
Posted 04-Nov-2022

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Graduate/ Early career opportunity: Technical Pre-Sales Specialist - Workstations

Vertriebsunterstützung

Vereinigtes Königreich, Renfrewshire, Renfrew
Anf. Nr.: WD00031035
Posted 07-Dec-2022

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Graphic Designer

Hardware-Engineering

Taiwan, Taipei City, Taipei
Anf. Nr.: WD00039393
Posted 28-May-2024

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Hardware Development Engineer

Hardware-Engineering

Vereinigte Staaten von Amerika, North Carolina, Morrisville
Anf. Nr.: WD00039457
Posted 26-Sep-2022

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Hardware Test Engineer

Hardware-Engineering

China, Shanghai, 上海（Shanghai）
Anf. Nr.: WD00043772
Posted 25-Oct-2022

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Hardware/Software Engineering Intern - Lenovo Workstation (HBCU Program)

Hardware-Engineering

Vereinigte Staaten von Amerika, North Carolina, Morrisville
Anf. Nr.: WD00015393
Posted 17-Nov-2021

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HK Intern

Rechtswesen

Hongkong, Hong Kong
Anf. Nr.: 100014521
Posted 22-Dec-2022

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HPC/AI Performance Benchmarking Engineer

Vertriebsunterstützung

Vereinigtes Königreich, Hampshire, BASINGSTOKE
Anf. Nr.: WD00041389
Posted 05-Oct-2022

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HR Admin Trainee (paid internship)

Personalwesen

Rumänien, Bucharest
Anf. Nr.: 100014381
Posted 10-Nov-2022

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HR Intern

Personalwesen

Mexiko, Distrito Federal, Mexico D.F.
Anf. Nr.: 100014361
Posted 21-Oct-2022

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