General Information

Req #
WD00043573
Career area:
Hardware Engineering
Primary Location
JP - Yokohama
Country/Region:
Japan
State:
Kanagawa
City:
Yokohama-shi
Date:
Friday, October 21, 2022
Working time:
Full-time
Posting Locations
JP - Yokohama
Additional Locations: 
* Japan - Kanagawa - Yokohama-shi

Why Work at Lenovo

We are Lenovo. We do what we say. We own what we do. We WOW our customers. 

Lenovo is a US$83 billion revenue global technology powerhouse, ranked #196 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo’s continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY). 

This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our StoryHub.

Description and Requirements

■Roles and responsibilities

-       Understand next-generation chipset specifications and create basic designs and prototype models

-       Appropriately understand the requirements from customers and the marketing department, perform high-level hardware design, and create technical specifications.

-       Perform detailed hardware design (circuit diagram, layout, wiring) based on technical specifications

-       Conduct unit tests or direct external development partners

-       Work with chip suppliers to debug and fix issues

-       Collaborate with ThinkPad mechanical and thermal design team to optimize motherboard shape and component placement

-       Collaborate with ThinkPad's software development team to optimize performance and power management

-       Collaborate with purchasing engineering team to optimize subsystem implementation

-       Communicate with product quality assurance and product engineering departments, identify and report on problem situations, and negotiate on problem corrections.

-       Collaborate with overseas ThinkPad development teams and development partners outside Lenovo to support ThinkPad development work

-       Report the development status to the project manager and people manager.

■Key Interaction with:

• Inside the Lenovo Yokohama office

o Circuit design, mechanical design, thermal design, BIOS/EC development, driver development, subsystem development

o Product quality assurance, product technology

• Overseas Lenovo offices

o ThinkPad China Development LAB (product development work)

o Procurement Engineering (China/Taiwan/USA)

o Manufacturing plant (China)

• Outside Lenovo

o Overseas partners (mainly Taiwan)

o Suppliers of each component (Intel, NVIDIA, etc.)


Requirements: Must Have

-       More than 5 years of experience in electrical design and development of electronic devices such as PCs, tablets, and digital home appliances

-       Understand the specifications of chipsets, GPUs, subsystems, etc.

-       Understand motherboard circuit diagrams and IC layouts

-       Understand graphics interface standards and specifications

-       Ability to communicate in English to conduct technical discussions in emails and meetings with overseas suppliers (reference: TOEIC score of 650 or higher. Applicants whose native language is not Japanese must have the ability to communicate in Japanese (Reference: Japanese Language Proficiency Test N2 or higher)


Requirements - Good to Have

- Experience in designing and developing PC graphics boards

- Experience in GPU-related design and development for PCs, tablets, digital home appliances, etc.

- Knowledge and practical experience to explain to others about hardware design of Intel CPU/Chipset and NVIDIA/AMD GPU

- Detailed knowledge and understanding of graphics interface standards and specifications

- Knowledge and practical experience to the extent that you can explain to others about high-speed bus architectures (electrical standards and bus protocols) such as USB/Thunderbolt/PCIe/SATA

* Japan
Kanagawa

Additional Locations: 
* Japan - Kanagawa - Yokohama-shi
* Japan - Kanagawa - Yokohama-shi
* Japan - Kanagawa
* Japan
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