General Information

Req #
WD00047437
Career area
Hardware-Engineering
Country/Region:
China
State:
Tianjin
City:
天津（Tianjin）
Date:
Montag, Dezember 12, 2022
Working time:
Full-time
Additional Locations: 
* China - Tianjin - 天津（Tianjin）

Why Work at Lenovo

We are Lenovo. We do what we say. We own what we do. We WOW our customers. 

Lenovo is a US$83 billion revenue global technology powerhouse, ranked #196 in the Fortune Global 500, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world’s largest PC company with a full-stack portfolio of AI-enabled, AI-ready, and AI-optimized devices (PCs, workstations, smartphones, tablets), infrastructure (server, storage, edge, high performance computing and software defined infrastructure), software, solutions, and services. Lenovo’s continued investment in world-changing innovation is building a more equitable, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992) (ADR: LNVGY). 

This transformation together with Lenovo’s world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. To find out more visit www.lenovo.com, and read about the latest news via our StoryHub.

Description and Requirements

Job Description (English)

1.  Excellent work attitude and tenacity is essential to job execution
2.  Well known about Intel/AMD platforms architecture, Arm is a plus.
3.  Insight to study new technology on advanced bus, chipset, cable, connector.
4.  Familiar with high speed buses electrical spec and design especially on PCIe Gen5/DDR5, et cetera.
5.  Familiar with low speed buses simulation and correlation (i.e. I2C/I3C/ESPI...).
6.  Familiar with Polar, IMLC, IMADC, ICAT, ADS, Hspice, PowerDC, PowerSI/SIWave, Clarity/HFSS, SigXplorer, Seasim, S2eye.
7.  3D simulation capability to find out optimized design on specific area.
8.  Placement discussion/implementation
9.  Stackup design including PCB material and copper foil selection
10. Routing rules creation
11. Capability on board file and CM review. Knowing constraint setting is a plus.
12. Familiar with VNA operation
13. Debug on signal integrity issues
14. Possess excellent integration capabilities, gather team opinions, simplify debug or specific event processing, and express logically in email or presentation for the other party to grasp information shortly.

Additional Locations: 
* China - Tianjin - 天津（Tianjin）
* China - Tianjin - 天津（Tianjin）
* China - Tianjin
* China
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